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Z490 Build

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kiwi View Drop Down
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Joined: February-10-2003
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Post Options Post Options   Thanks (0) Thanks(0)   Quote kiwi Quote  Post ReplyReply Direct Link To This Post Posted: November-07-2021 at 5:23pm
Thanks,
I was only mulling the idea over but i am quite happy with 5.0gig. So i think at
this point i will try the 3d test and call it quits. May play again sometime in the future.
Les
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NickN View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote NickN Quote  Post ReplyReply Direct Link To This Post Posted: November-07-2021 at 5:35pm
That thick compound you call thermal 'paste' is not paste. It is a TIM compound pad and they are designed to be thick before first contact. They compress and melt as the heat up and create a contact bond between the liquid head and the CPU.

If you remove the liquid head off the CPU it breaks the TIM compound seal and it will require complete cleaning of the CPU and liquid head, then application of a decent thermal 'paste' which is different.

I found the TIM pad that came with the H150i to be good. I did not have any reason to replace or change it.

If you want to try replacing the TIM with a paste (or something like liquid metal CoolLabratory Pro), you can, but just remember once a TIM pad seal has been broken by removing the liquid head, you can not put it back on without cleaning the TIM off both parts and replacing it with paste or compound. 

Pulling it off and putting it back on with the same TIM is a no-no.



I have never heard of a tower with all fans blowing out..   that seems strange. Typically there is some type of pass through air flow that brings cool air from outside the tower, inside, and then expels heat from inside the tower, out.

Which way and which direction can sometimes be a matter of trial and error. And if a tower is jammed under a desk it can succumb to recirculating its own heat as the heat is trapped und the desk or in a cubby. Tower needs to be able to breath. 

In with the good air, out with the bad 



Folks have said my suggestion for towers in the past are monster boxes. Smaller or more compact towers can't breathe the same volume of air a good size full tower can and although the larger towers may appear to be somewhat obtrusive, with the fans and air volume they provide, they can sometimes make a positive difference to the end result


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NickN View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote NickN Quote  Post ReplyReply Direct Link To This Post Posted: November-07-2021 at 7:38pm
Be careful about changing fans around, etc an then changing the test.

In other words, if you have established a 5.0 tested clock and recorded your min/max temps over those tests, then don't start flipping things around and changing compound to see what 5.1 does...  keep changes to one at a time and rerun the high temp LINPACK test for like 15 minutes a shot @5.0 in order to do a direct established compare.

If you see a positive change, then perhaps add another change into the mix and repeat 5.0 Linpack for analysis. Don't just jump to 5.1 until you have gone through what ever you can with 5.0 to see reductions in temps.

Your diagnostic in this respect is important because if you make a lot of changes in one swoop and then just try jumping to 5.1, you are not maintaining a established repeatable experiment that can be compared easily.

It could be possible replacing the TIM pad with a liquid metal compound is better due to unseen factors....  but it could, in theory, run hotter. There is no way to know without making the change and you can not replace the TIM pad Corsair provided with the liquid head unless they sell that separate from the complete system in the box.


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robmw View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote robmw Quote  Post ReplyReply Direct Link To This Post Posted: November-08-2021 at 12:56pm
Just as a possible point of interest (and comparison) I was able to complete this same build over the summer and have been using it since then.

First of all, I never got to 5.1 and was hitting the wall with 5.0. The possible reason? I really wanted to reuse a Lian-Li super case from an old build but with the one disadvantage that it only had room for 2 x 140mm fans at the top so I had to use the Corsair H110i cooler (280mm). In percentage area terms not such a big difference but it was key in my not hitting 5.1 I think! Basically that cooler can handle around  220-230w processor load, not enough for 5.1 or higher with the 10900K. 

Originally Nick asked if I was interested in trying the build on air just to see where I could get. Unfortunately I didn't have the time back then but I suspect the results might have been similar.

That said, in actual use with all my current sims (including MSFS) it's more than enough. In fact I have three tested profiles, 5.0, 4.9 and 4.5. Even at 4.5 it cruises along nicely at even lower voltage, power and temps and I find I'm using that profile most of the time currently.

After experimenting I found having my rad at the top, exhausting air pulled in from the front plus a rear exhaust fan, was best at cooling the rad and getting rid of heat from the GPU which I hadn't fully considered at first. I also use high performance fans and the ones on the rad are pressure rated to force the air through. It's a bit noisy at full throttle (only needed during clock testing) but in normal use not a problem at all.

I appreciate there may be a more than linear jump in performance going to 5.1 or higher and that's an option to try with a new case if I ever feel the need.

Rob
i9 10900K @4.9 GHz, Asus Maximus Hero XII, 32GB 4000 DDR4, Asus RTX 3090, Samsung NVme SSDs, Windows 10 Pro 64.
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Donovan16 View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Donovan16 Quote  Post ReplyReply Direct Link To This Post Posted: November-09-2021 at 7:36pm
Les,
There is no graph produced by HWMonitor.  Haven't you been writing down or otherwise saving the data from HWMonitor readout screen?  

I found the HWMonitor, or HWInfo64 readouts much more accurate than OCCT's reported temps.  The stress tests are sound, except for the false FAILS some of us experienced in the first couple minutes of the stress tests.  (-- see the guide outline.)

Originally posted by kiwi kiwi wrote:

 Looking at the graph for temp, the max which is only a spike is much higher that the average. Do still go by the spike value even though its very short.

Look at the min/max column of the HWMontior for your CPU package temps, and max power draw.  Follow exactly the outline given in the guide.

If you're not sure what to do, post your results here, but I think its pretty straightforward.  Don't use the OCCT Graph, use your HWMonitor results.

Don
i9 10900K 5.2 GHz, ROG Maximus Hero XII, RTX 3090, 32 Gb GSkill TridentZ 4000 15-16-16, 1Tb Samsung 970 EVO Plus, 2Tb Samsung 860 Pro SSD, (2) 2 Tb WD 7200 HDs, Corsair H150i, Win10 Pro x64
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